By Francois Bancilhon, Gilles Barbedette (auth.), Klaus R. Dittrich (eds.)
This quantity collects papers provided on the second foreign Workshop on Object-Oriented Database platforms (ooDBS-II) held on the Ebernburg close to undesirable Münster am Stein, FRG, in September 1988. It therefore supplies a accomplished evaluate of the newest advancements during this flourishing zone of present database study. Object-oriented database structures were approached with in general significant intentions in brain, specifically to higher aid new program parts like CAD/CAM, workplace automation, wisdom engineering, and to beat the 'impedance mismatch' among facts types and programming languages. The proposal of object-orientation in database structures is hence a broader one than e.g. within the sector of programming languages. Structural object-orientation offers for info version mechanisms that let the direct illustration and manipulation of highly-structured entities; behavioral object-orientation cares for amenities to affiliate arbitrary user-defined type-specific operations with facts entities; eventually, complete object-orientation attempts to mix the benefits of either different types. even though information version strategies are the decisive function of object-oriented database structures, various different process features must be reconsidered or permit larger strategies, respectively, during this gentle. They contain e.g. transactions, implementation recommendations, optimization, formalization, the inclusion of principles, and the mixing with different platforms. a couple of learn prototypes or even a few advertisement platforms are in the meantime on hand. either, techniques to increase databases with object-oriented features and methods to increase object-oriented programming languages with database positive aspects were and are being investigated.
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Additional resources for Advances in Object-Oriented Database Systems: 2nd International Workshop on Object-Oriented Database Systems Bad Münster am Stein-Ebernburg, FRG September 27–30, 1988 Proceedings
Due to the limitations of the assembly setup, it was not possible to evaluate the performance in this direction. This can be done by measuring the optical coupling . C. van Gurp, M. Tichem, and U. Staufer Conclusion This paper reports on the design, fabrication and testing of assembly features for submicron accurate passive alignment of photonic chips on a silicon optical bench. From the various results and discussions, the following conclusions can be drawn. First of all, the alignment edges on the various counter features on the SiOB could be manufactured within the same lithography and etching steps as the actual waveguides.
Additional thin film metallization of the outer layers prevent electric charging of the assembly in the EOC. Fig. 4. LTCC carrier Fig. 5. Schematics of the LTCC carrier layer stack Precisely Assembled Multi Deflection Arrays – Key Components 5 45 Solder Bumping Fixation Technology A fine pitch Solderjet Bumping technology was applied for fixation and contacting of the MDA with respect to the LTCC carrier and second for the fixation of two carriers after alignment. g. tin-based lead free solders or eutectic gold-tin (Au80Sn20) onto different substrates, such as flip chip or MEMS/MOEMS devices.
Acknowledgements. This work was supported by the European Commission via the project HYDROMEL (FP6 NMP2-CT-2006-026622). References 1. : Advanced MEMS Packaging, 1st edn. McGraw-Hill (2009) 2. : Controlled collapse reflow chip joining. IBM Journal of Research and Development 13(3), 239–250 (1969) 3. : Cost analysis: solder bumped flip chip versus wire bonding. IEEE Transactions on Electronics Packaging Manufacturing 23(1), 4–11 (2000) 4. : Automated Microassembly. -R. , London, UK. The Institution of Electrical Engineers (2004) 5.